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380×600mm Table · 300kg Max Load · 300–600mm Max Workpiece Thickness
The SX7732-H is a high-precision CNC abrasive wire cutting machine within the SX77-H Series, designed for smooth and accurate cutting of hard and brittle materials using a unidirectional closed-loop ring wire system. Its design focuses on eliminating vibration, maintaining a consistent cutting angle, and delivering superior surface finishes—especially critical in materials like ceramics, glass, and sapphire.
Compact CNC Ring Wire Abrasive Cutting Machine SX7732-H
Spare parts supply
On-site installation service
Customized design
Why Choose Our CNC Solutions
Key Features
- ● Unidirectional ring wire movement delivers stable, high-speed abrasive cutting.
- ● CNC motion system ensures programmable accuracy for complex shapes or layer slicing.
- ● Rigid mechanical design ensures excellent repeatability on brittle substrates.
- ● Capable of processing thick materials (up to 600mm) without thermal damage.
- ● Ideal for precision ceramic, quartz, and non-metallic composite applications.
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Recommended Configurations
- ● Loop wire drive unit: Provides stable, continuous cutting with uniform abrasion.
- ● Precision clamp system: Ensures rigid fixation for fragile block materials.
- ● Mist suppression enclosure: Reduces airborne particles during dry or slurry cutting.
- ● Wire tension monitoring sensor: Maintains precise wire force across thick materials.
- ● Programmable touch panel: Allows step-cut programming and wire speed adjustment.
- ● Edge coolant micro-sprayer: Minimizes heat stress and enhances edge clarity.
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Application Case
- ● Client: Optical Glass Component Manufacturer – Singapore.
- ● Use Case: Cutting thick quartz substrates for high-precision lens assembly.
- ● Setup: SX7732-H with programmable feed rate, mist suppression system, and tension feedback control.
- ● Results:Thickness uniformity: ≤ ±0.025 mm,Edge chipping: Undetectable under 100× magnification,Dust level: Reduced by 60% using closed mist system,Client feedback: “The SX7732-H consistently produces crack-free quartz panels, making it a staple in our optical fabrication line.”
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Product Specifications
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Frequently Asked Questions
Minnuo’s CNC abrasive wire cutting machines are ideal for hard and brittle materials such as sapphire, silicon wafers, silicon carbide, ceramics, quartz, magnetic materials, and rare metals.
A diamond-coated or abrasive wire continuously moves through the workpiece under controlled tension, achieving precise material removal by micro-grinding action, ideal for high-precision, low-damage cutting.
Our machines achieve cutting accuracy within ±0.01–0.02 mm, and surface roughness Ra 0.4–0.8 μm, depending on material properties and cutting parameters.
Absolutely! Just send us your material type, block size, required cut thickness, and tolerance, and Minnuo’s engineers will recommend the best abrasive wire cutting machine within 10 minutes.
Yes! We offer customizations including cutting stroke (X/Y/Z), maximum workpiece size, wire type (single wire/double wire), tension control system, and CNC system brand based on customer requirements.
Minnuo machines feature high-stability tension control, servo-driven wire feeding, constant wire speed regulation, and are calibrated with laser interferometer and precision measuring instruments before shipment.
Standard models are delivered within 30–45 working days. Customized or high-end versions usually require 45–60 working days.
Minnuo provides a one-year warranty, 24/7 technical support, remote online guidance, on-site commissioning services, and long-term spare parts support.
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